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2025-05-02 3D-IC Introduction -- the Trend and Challenges

時間:2025-05-02(五) 15:20 pm

講題:3D-IC Introduction -- the Trend and Challenges

講者:黃貞浩 資深處長

服務單位:益華電腦科技公司

地點:93456

主持人:許蘇文 教授

 

摘要 :

  • In today’s era of Artificial Intelligence and Machine Learning applications, the driving factors require faster computation, storage, large models, and speed.  However, these factors are faced with new challenges as these chips are moving from 2D-IC to 3D-IC due to the slowing down of Moore’s Law.
  • This presentation would be the 3DIC 101 to introduce the basics and types of 3DIC along with their challenges and the resolutions to meet the upcoming era of chiplet designs and demands. 

 

學歷 :

 

Education ( 1987 ~ 1993 )

Jason received his M.S.(1991~1993) and B.S.(1987~1991) in Chemical Engineering from NCKU, Taiwan. His research focused on material science and plasma engineering, where he published several papers regarding diamond thin film formation by chemical vapor deposition.

Cadence ( 2016 ~ )

Jason rejoined Cadence as Product Engineering Group Director to support TSMC and UMC foundry design enablement including 3DIC flow and electrical/physical signoff solutions.

CellMax Life ( 2014~ 2016 )

Jason joined startup biotech company CellMax Life doing general management which developed and offered CTC cancer screening resolution including colon and breast cancers.

Cadence ( 2007 ~2014 )

Jason started with Cadence as DFM (Design for Manufacturing) Product Engineering Director through ClearShape acquisition. He is heading a team responsible for DFM related products in Asia Pacific region working closely with foundries (ex: tsmc, UMC and SMIC) to get DFM solutions qualified (and endorsed) which is key to business success for Cadence’s DFM related products with foundries and fabless companies

ClearShape Technologies ( 2005 ~ 2007 )

Prior to Cadence, he joined startup company ClearShape Technologies ( a DFM company) served as Senior Director of Asia Pacific Operations. He started up a remote office in Taiwan and doing general management . With ClearShape, he managed the team working very closely with tsmc and UMC. In two years, ClearShape DFM softwares got qualified and depolyed by both tsmc and UMC. As the results, he succssfully closed company’s first over million dollar deal with UMC as well as becoming tsmc first and only DFM LPC (Litho Pattern Check) supplier

Synopsys ( 2002 ~ 2005 )

Before ClearShape, he worked for Synopsys through Numerical Technologies acquisition served as Senior CAE Manager of Silicon Engineering responsible for OPC and RET related softwares for Asia Pac region where he stabilized and grew the regional team and to enlarge market share via strategic penetration into few key accounts such as Chartered, Samsung and HHNEC

Numerical Technologies ( 1999 ~ 2002 )

During Numerical, Jason held several management positions including Applications Engineering Director, Strategic Marketing Director and Technical Marketing Director responsible for project management with wafer fabs and mask shops for litho and mask related softwares

Precision Photomask Corporation ( 1998 ~ 1999 )

Prior to Numerical, he joined the startup company Precision Photomask Corporation(acquired by Photronics afterward) where he initially built up and managed the process and equipment engineering team. And then he led R&D group before his departure.

UMC ( 1995 ~ 1998 )

Before joining Precision Photomask, Jason was senior engineer in UMC mainly responsible for litho stepper/scanner and photomask engineering 

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